JPH0621707Y2 - 耐熱用多層板の構造 - Google Patents

耐熱用多層板の構造

Info

Publication number
JPH0621707Y2
JPH0621707Y2 JP16325088U JP16325088U JPH0621707Y2 JP H0621707 Y2 JPH0621707 Y2 JP H0621707Y2 JP 16325088 U JP16325088 U JP 16325088U JP 16325088 U JP16325088 U JP 16325088U JP H0621707 Y2 JPH0621707 Y2 JP H0621707Y2
Authority
JP
Japan
Prior art keywords
heat
resistant
metal screen
metal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP16325088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0282525U (en]
Inventor
信久 野口
Original Assignee
石川島播磨重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 石川島播磨重工業株式会社 filed Critical 石川島播磨重工業株式会社
Priority to JP16325088U priority Critical patent/JPH0621707Y2/ja
Publication of JPH0282525U publication Critical patent/JPH0282525U/ja
Application granted granted Critical
Publication of JPH0621707Y2 publication Critical patent/JPH0621707Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
JP16325088U 1988-12-16 1988-12-16 耐熱用多層板の構造 Expired - Lifetime JPH0621707Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16325088U JPH0621707Y2 (ja) 1988-12-16 1988-12-16 耐熱用多層板の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16325088U JPH0621707Y2 (ja) 1988-12-16 1988-12-16 耐熱用多層板の構造

Publications (2)

Publication Number Publication Date
JPH0282525U JPH0282525U (en]) 1990-06-26
JPH0621707Y2 true JPH0621707Y2 (ja) 1994-06-08

Family

ID=31447811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16325088U Expired - Lifetime JPH0621707Y2 (ja) 1988-12-16 1988-12-16 耐熱用多層板の構造

Country Status (1)

Country Link
JP (1) JPH0621707Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003219858A (ja) * 2002-01-30 2003-08-05 Tokai Corp 携帯灰皿

Also Published As

Publication number Publication date
JPH0282525U (en]) 1990-06-26

Similar Documents

Publication Publication Date Title
JP2001308548A (ja) 多層印刷回路基板及びその製造方法並びに多層印刷回路基板を利用したbga半導体パッケージ
JPH0679710A (ja) 大型セラミック基板及びその製造方法
JPH06326438A (ja) 単層配線ユニットおよび多層回路配線板ならびにその製法
JPH0621707Y2 (ja) 耐熱用多層板の構造
JPS59205747A (ja) 半導体装置の製造方法
JP2536274B2 (ja) ポリイミド多層配線基板の製造方法
JP3946114B2 (ja) 多層回路配線基板の製造方法
JP2001119145A (ja) 多層フレキシブル配線板
JP2004311628A (ja) 多層基板およびその製造方法
CN219778912U (zh) 驱动背板以及显示面板
JPS58171873A (ja) サ−モパイルの製造方法
JP2753740B2 (ja) 可撓性回路基板の製造法
JP2002171063A (ja) 多層フレキシブル配線板
TW201034129A (en) Frame-type copper- clad ceramic substrate and the manufacturing method thereof
TWI246750B (en) A carrier for stacked chips and a method for fabricating the same and a semiconductor package with the chip carrier
JP2901155B2 (ja) 磁気シールド材、多層磁気シールド材または電磁波・磁気シールド材の製造方法
CN105682384B (zh) 一种柔性多层线路板及其制作方法
JPS61121489A (ja) 基板製造用Cu配線シ−ト
JP2727602B2 (ja) 多層回路基板の製造方法
JPH08236980A (ja) シールド基板及びその製造方法
CN119031575A (zh) 多层电路板、焊接结构及其制备方法
JPH11220288A (ja) 電磁波・磁気シールド材および電磁波・磁気シールド工法
JP2739349B2 (ja) 電子部品搭載用基板
JPS5828759B2 (ja) 多層プリント板
JPH0546296Y2 (en])